An IC card comprises a thermoplastic resin core sheet (1) and IC chip (3) bearing a conductive projection (5) formed on an electrode of IC chip (3), the IC chip (3) being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern (6) formed on the main surface of the core sheet is extended for contact with the exposed top surface.