High frequency electrical connection appts. - has triple plate arrangement of thin layers on flexible polyimide substrates with electric through contacts

摘要

The appts. suitable for transmitting high-frequency currents, for making electric connections between IC's and/or pcbs, and/or passive components, has a flat substrate film (8) on which several successive layers are arranged. These layers include an electrically conductive layer (9), an insulating layer (10), a layer with a number of conductive tracks (5), a second insulating layer (11) and a second conductive layer (12). The conductive layers (9, 12) are formed by thin layer technology. These have recesses (14) therein in which through-contacts (13) to the tracks (5) are provided. ADVANTAGE - Can be used at high frequencies up to 90 GHz and enables flexible connecting of number of components in simple manner.