VERFAHREN ZUM VERBINDEN VON KONTAKTSTUECKEN MIT EINEM KONTAKTTRAEGER DURCH HARTLOETEN

摘要

Especially in the case of contact layers made of a silver-metal oxide (AgMeO)-based material whose backside is provided with hard solder, it has been observed that the hard solder may indesirably ascend to the contact surfaces during hard soldering on a contact substrate. This is explained by the heat produced during hard soldering. According to the invention, the wettability of the side surfaces of the contact layers is reduced in order to prevent the hard solder from ascending to the printed circuit surface. Preferably, metal oxides are inserted for this purpose into the surfaces of the contact layers. In the case of silver-metal oxide (AgMeO)-based contact layers, metal oxides that are already available in the material as active elements are preferably used.