| 摘要 |
PURPOSE:To plate a side conductor uniformly in thickness without plating an unnecessary part by coating the interior of a through hole with conductor paste, then extending the hole to the outer edge of the hole, and opening a second through hole for removing the conductor paste layer of the outer edge. CONSTITUTION:First through holes 7 are opened at a package body 1 and the connector of the outer edge 2 of the body, and ceramic green sheets 3a, 3b coated with conductor pastes 8a, 8b are formed on the inner walls of the holes. Then, after second through holes 9 are so formed as to be superposed on the inner wall of the outer edge 2 of the hole 7, the sheets 3a, 3b are baked. Thereafter' at least the conductor paste 8a of the baked sheet at the inner wall of the hole 7 at the side of the body 1 is plated at 11, the outer edge 2 is separated from the body 1. For example, a semiconductor element mount 4, an inner electrode 5 and an outer electrode 6 are formed of the conductor paste at predetermined forming positions of the sheets 3a, 3b. |
