发明名称 MOLD ASSEMBLY FOR MOLDING RESIN SEALING SECTION OF ELECTRONIC PART
摘要 PURPOSE:To position a center block accurately to a template. CONSTITUTION:A recessed groove 51 extended in the longitudinal direction is formed to the mounting surface 3a of a template 3. A center block 6 is fitted into the recessed groove 51, and installed to the template 3. The end faces of chases 7 are abutted against the left and right side faces of the center block 6, and these chases 7 are mounted to the template 3. The center block 6 forms a shot cavity 15 and runners 17, 18, 19. The chases shape a runner 22 and a mold cavity 23. A positioning block 28 is also fitted into the recessed groove 51. Accordingly, the center block 6 can be positioned positively in the horizontal direction particularly, and the end faces of the chases 7 are abutted positively against the side faces of the center block 6. The center blocks 6 of a top force and a bottom force 1 are mutually abutted accurately by the positioning clock 28 on mold clamping.
申请公布号 JPH05104586(A) 申请公布日期 1993.04.27
申请号 JP19910272713 申请日期 1991.10.21
申请人 MITSUBISHI MATERIALS CORP 发明人 OBARA MITSUHIRO
分类号 B29C45/02;B29C45/14;B29C45/26;B29C45/36;B29L31/34;H01L21/56 主分类号 B29C45/02
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