| 摘要 |
Provided is a cooling system for transferring heat away from heat dissipative devices. The cooling system includes a thermally conductive heat sink member which is connected on one side to a heat dissipating device and attached on the second side to a resilient bellows pipe element filled with liquid coolant. The other end of the bellows is attached to and communicates with an evaporator section which communicates with a condenser section. The thermally conductive heat sink member, which may include thermally conductive fins, conducts transfers heat energy from the heat dissipating device to the liquid coolant. As the liquid coolant in the heat pipe heats and expands, the liquid in evaporator section of the cooling system can evaporate, the vapor passing to the condenser section. Vapor cools and returns to liquid state in the condenser section, wherein it is gravitationally returned to the evaporator section of the cooling device.
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