| 摘要 |
<p>PURPOSE:To improve the quality of a semiconductor equipment by preventing a transverse bend of a lead, a solder adhesion or a scratch. CONSTITUTION:A bending punch 1 constitutes a working die for an external lead of the semiconductor equipment and the tip of the external lead is bent by it. Straightening grooves 2 having a width each a little larger than the lead width are provided on the bending punch 1 corresponding to the lead, therefore, the lead is prevented being bent transversely by this groove 2.</p> |
