| 摘要 |
PURPOSE:To obtain the subject film exhibiting high adhesiveness when heated at a low temperature in pressing by coating a substrate with a polyimide precursor derived from a specific tetracarboxylic acid dianhydride, a diamine, a diaminosiloxane and an aminosilane, and heating and curing the coating film. CONSTITUTION:The objective silicon-modified polyimide film having the recurring unit of formula VII is obtained by reacting (A) a tetracarboxylic acid dianhydride of formula I (L<1> is O, CO, etc.), (B) a diamine of formula II (L2 is O, CO, S, etc.), (C) a diaminosiloxane of formula III (R<1> is 1-6C alkyl, phenyl, etc.; R<2> is group of formula IV, formula V, etc.) and (D) an aminosilane of formula VI (R<3> is same as R<2>; R<5> is same as R<1>) at 0-150 deg.C at molar ratios satisfying the formulas C/(B+C)=0.1 to 1 and D/(B+C+D)=0.01 to 0.5, applying the obtained polyimide precursor solution to a substrate and curing the coating layer by heating. |
