| 摘要 |
<p>PURPOSE:To use a wafer carrier again after regeneration by polishing a surface roughened wafer carrier groove part in a regenerating method and a device thereof for a wafer carrier groove whose dust exerts a bad influence upon yield. CONSTITUTION:A wafer carrier inside groove polishing method and a device thereof are constituted in such a way that plural number of polishing boards 3 are installed in a wafer holding groove 2 arranged on the inner wall of a wafer carrier 1, and the polishing boards 3 are rotated from the bottom part of the wafer carrier 1 for a constant time by means of a wafer rotating machine 4, and polishing of the groove 2 is carried out, and the polishing of the groove 2 is also carried out in a clean air box 7 having an air filter 8 from which air is breathed-in by means of a vacuum pump through an air intake tube 9.</p> |
