发明名称 |
Flat multicore wire and method of forming the same wire |
摘要 |
The present invention improves the quality and productivity in a coating peeling-off process in which the coating at an intermediate portion along the length of a wire is peeled off in order to expose a conductor inside the coated wire, while enabling coatings at intermediate portions along the length of multicore wires or small-diameter wires to be peeled off. In a primary process, a heating jig 16 is brought into press contact with the upper half portion of the coating of the peeling-off designated portion at an intermediate potion along the length of coated wires 1 so as to press down the coating downwardly relative to the transverse direction of the wires, whereby a coating peeled-off portion 20 in which a part of conductors 2 is exposed is formed. Afterwards, in a secondary process, the coating of the coating peeled-off portion 20 is cut and press held at the ends thereof by cutting and peeling-off blades 13 adapted to operate from the ends of the coating peeled-off portion 2 toward the center thereof so as to remove the coating of the coating peeled-off portion 20, whereby a coating peeled-off portion 131 is formed.
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申请公布号 |
US5206462(A) |
申请公布日期 |
1993.04.27 |
申请号 |
US19920903960 |
申请日期 |
1992.06.26 |
申请人 |
SUMITOMO WIRING SYSTEM LTD. |
发明人 |
IURA, KAZUO;YAMANO, YOSHIAKI;SAKA, KAZUHITO |
分类号 |
H01R43/02;H01R43/28;H02G1/12 |
主分类号 |
H01R43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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