| 摘要 |
A molded, plastic integrated circuit package is formed wherein a silicone compound is first applied over the exposed surface of the integrated circuit, its bonding wires, and portions of the lead frame including those portions where the bonding wires are attached. Following application of the silicone compound and before molding in plastic, the silicone compound is cured to set and harden the material. With the bonding wires and bonding points thus encapsulated by the silicone compound, the bonding wires are protected from lateral bending forces caused by viscous forces during the process of forming the molded plastic package, and from longitudinal expansion and contraction forces during thermal temperature cycling of the package. |
