CONDUCTIVE METAL-FILLED SUBSTRATES WITHOUT DEVELOPING AGENTS

摘要

A conductive metal-filled substrate is formed by intermingling copper or nickel particles into a substrate having a softening point of at least 200.degree.C followed by compression molding at a temperature of at least 200.degree.C. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.