| 摘要 |
A mounting for a semiconductor chip is composed substantially of polysilicon materials and incorporates integral heat dissipating elements into its design. The mounting can be cast from molten polysilicon or machined from a block of solid polysilicon depending on the shape and complexity of design of the mounting and heat dissipating elements. Polysilicon has excellent heat transfer properties and is closely matched to silicon in its coefficient of thermal expansion thereby reducing mechanical stress between the mounting and the chip. The semiconductor chip is attached directly to the polysilicon mounting establishing a direct thermal pathway between the heat generating chip and the heatsink elements of the mounting. The configuration of using direct attachment to a polysilicon mounting creates a thermally efficient package with greatly enhanced heat transfer capabilities and reduced mechanical stress. The mounting can accommodate both single and multi-chip applications in a variety of arrangements. The packages made from polysilicon can therefore become an integral and active part of the functionality of the chip from the point of view of interconnect, signal integrity and thermal management while also improving manufacturability and long term reliability.
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