发明名称 LIGHT HEATING DEVICE
摘要 PURPOSE:To reduce the soldering defect caused the oxidation generating during heating and to improve the working efficiency of the soldering, by reducing an oxygen content surrounding the material to be heated being irradiated in a light heating device that the light of the light condenser part of the light emitting part of xenon lamp, etc., is irradiated on the material to be worked. CONSTITUTION:The soldering defect caused by the oxidation function generating during light radiating can be reduced with the constitution that a sealed gas of oxygen content <=0.5% supplying means composed of a gas bombe 11, a gas regulator 12, a gas valve 13 and a gas nozzle 10 is provided around the circumference that the material to be heated 5 is heated and melted by using an ellipse reflecting mirror 2 and a condenser lens 7 which condense light, and further a gas temperature adjusting unit 14 is provided at the sealed gas supplying route, and the working efficiency can be improved by pre-heating the material to be heated 5 by rising the temperature of the sealed gas with the gas temperature adjusting unit 14.
申请公布号 JPH05104279(A) 申请公布日期 1993.04.27
申请号 JP19910265851 申请日期 1991.10.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUJII KOJI
分类号 B23K1/005;B23K26/00;B23K26/12;C21D1/34;C21D1/74;H05B7/22 主分类号 B23K1/005
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