| 摘要 |
<p>PURPOSE:To improve heat dissipation of a hybrid IC and to particularly improve thermal conductivity by placing an IC bare chip on a metal board. CONSTITUTION:A metal board 5 to be guided at an end out of a circuit board 1 is adhered to the surface of the board 1, and an IC bare chip 2a having much heat generating amount is placed thereon. The board 5 is bent at the edge of the board 1 in the same direction as that of a lead terminal 4, and when it is connected to an external board, the end of the board 5 is also connected. A component which is not necessarily considered for heat dissipation such as a bare chip 2b, an IC component 3 having small heat generating amount is placed on the board 1.</p> |
