| 摘要 |
<p>PURPOSE:To cut down the number of assembling process, and to prevent the generation of a defective leg floatage by providing bending function on a molding mold. CONSTITUTION:After a semiconductor chip 5 has been adhered to a lead frame, a wire bonding and resin sealing operation is conducted. The mold to be used in a resin sealing and molding operation consists of an upper mold 10 and a lower mold 11, and the bending mold for an outer lead 4 is also contained therein. Also, a resin stopper 12 is used to prevent resin leaking from the outer lead. A bending and molding work is conducted in the same process. As a result, a bending process is omitted from the assembling process of a semiconductor device, and manhours can be reduced. Also, as the bending work is done when molding and heat is added for along period, the jumping up such as a spring back can be eliminated, and no trouble such as defective floatage takes place.</p> |
