| 摘要 |
PURPOSE:To form wiring patterns with high reliability so as to avoid the increase of the thickness of the edge part of a thin film multilayer circuit board when interlayer insulating layers are formed. CONSTITUTION:A wiring layer 12 has wiring patterns 2-1 which are formed on a ceramics insulating board 1 and a plurality of dummy patterns 12-2 which are formed along the edge part of the insulating board 1 so as to surround the wiring patterns 2-1. An interlayer insulating layer 13 is made of liquid insulating agent which is dropped on the center part of the upper surface of the insulating board 1 and spread into a planar form by spin-coating. The wiring layers 12 and the interlayer insulating layers 13 are alternately built up on the pattern forming surface side of the ceramics insulating board 1. |
