| 摘要 |
PURPOSE:To provide a photosensitive resin composition short in developing time and wide in developing latitude. CONSTITUTION:This photosensitive resin composition comprises a polyamido acid having repeating units each represented by formula I; a polymerizable unsaturated compound represented by formulae II and III; a photopolymerization initiator; and an organic solvent, and the method for developing this photosensitive material is described. In formulae I-III, each of R3-R5 and R8-R10 is H or alkyl; each of R6, R7, R12, and R13 is a divalent hydrocarbon group; each of R11 and R14 is a tetravalent organic group; each of Y1-Y6 is H or a univalent organic group having ethylenically unsaturated group, each one of Y1-Y3 and Y4-Y6 is a univalent organic group having ethylenically unsaturated group, R1 is tetravalent arom. group, and R2 is divalent organic group. |
