PATTERN FORMING MATERIAL AND MULTILAYERED WIRING BOARD FORMED BY USING THIS MATERIAL

摘要

PURPOSE:To provide the pattern forming material which can be formed as a thick film and has high reliability and the multilayered wiring board formed by using this material. CONSTITUTION:This pattern forming material 3 contains the polysiloxane obtd. by the hydrolysis and condensation of alkoxysilane having an oxysilane ring and an azide compd. This multilayered wiring board is constituted by using this pattern forming material 3 as an interlayer insulating film or surface protective film. The pattern forming material 3 may contain a sensitizer and/or an org. high polymer having a hydroxyl group at need. Then, this pattern forming material 3 is highly resistant to heat and has the advantage that fine patterns can be formed even with thick films. Since the steep patterns are obtainable, the use of the patterns as mask patterns is possible as well.