发明名称 MOUNTING STRUCTURE AND METHOD OF FLAT TYPE POWER SUPPLY ELEMENT ONTO CIRCUIT SUBSTRATE
摘要 PURPOSE:To mount a flat type power supply element having an excellent sealing structure onto a circuit substrate with high reliability without remarkable increase in the thickness of a power supply part. CONSTITUTION:A case 2, which serves as one terminal, made of a metal and an electrode part 7, which serves as the other terminal, adhered inside of the case 2 via an insulating layer 8 are provided, an opening 6 which exposes a part of the electrode plate 7 is formed in the case 2. A flat type power supply element 1 is mounted onto a circuit substrate 16 where a first and a second connecting parts 19 and 20 are provided. An insulative adhesive layer 21 is formed on the circuit substrate 16, a first and a second removed parts 22 and 23 are provided in the adhesive layer 21. The first conducting member 26 electrically connects the case 2 to the connecting part 19 through a removed part 22, and the second conducting member 27 electrically connects the electrode plate 7 to the connecting part 20 through the removed part 23 and the opening 6.
申请公布号 JPH05101813(A) 申请公布日期 1993.04.23
申请号 JP19910258190 申请日期 1991.10.05
申请人 MURATA MFG CO LTD 发明人 KUNISHI TATSUO;WATANABE KOICHI;ENDO MASANORI;HIGUCHI MASATO
分类号 H01G11/66;H01G2/02;H01G9/00;H01G11/00;H01G11/74;H01G11/78;H01M2/10 主分类号 H01G11/66
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