| 摘要 |
PURPOSE:To reduce manufacturing cost, increase reflection efficiency at the time of light emission, and improve stability for soldering of a plated layer which is used as a terminal for packaging. CONSTITUTION:Silver-plated layers 20a, 20b are formed from the surface to the rear of a substratum 10 which is constituted of a resin molded object and has a recessed part 11 on the surface. A light emitting diode 30 is mounted on the silver-plated layers 20a, 20b in the recessed part 11, which is filled with sealing resin 40. Protective plated layers 50a, 50b composed of tin or solder are formed on the silver-plated layers 20a, 20b outside the recessed part 11 which layers are exposed from the sealing resin 40. The plated layer in the recessed part 11 covered with the sealing resin 40 is only the silver-plated layer, so that the reflection efficiency at the time of light emission is increased. The plated layers outside the recessed part 11 which layers are exposed from the sealing resin 40 have a structure wherein the silver-plated layers are covered with the protective plated layers composed of tin or solder, and are excellent in stability for soldering. |
