| 摘要 |
<p>PURPOSE:To enable manufacturing many kinds of semiconductor relays, and restrain irregularities of a gap between lead frames which are caused by external force at the time of molding. CONSTITUTION:When a semiconductor relay wherein an input element and an output element face each other is manufactured, spacers 6, 7 are interposed between lead frames 2 and 5 wherein an input terminal and an output terminal are formed in the case of molding. Molding is performed by using meal molds 10, 11 and molding material 12. Thereby the gap between a light emitting diode 1 and a photovoltaic element 3 is made almost constant. Only by changing the kinds of the spacers 6, 7, the lead frames 2, 5 and the metal molds 10, 11 are commonly used.</p> |
