MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To easily break a large-area glass substrate, to reduce stress and strain which are caused by twisting on a semiconductor device being broken as far as possible and to enhance the yield and the reliability of the semiconductor device when, after a plurality of semiconductor device have been formed on the glass substrate, individual semiconductor devices are manufactured. CONSTITUTION:Scribing grooves 50 having a desired pattern are formed on a large-area glass substrate 13 on which semiconductor elements 10 have been formed; after that, the glass substrate 13 is immersed in a very-low-temperature liquid such as liquid nitrogen or the like; a thermal shock due to cooling is given; and the glass substrate 13 is broken along the scribing grooves 50.