| 摘要 |
PURPOSE:To enable mounting wherein an optical axis becomes parallel with a mounting surface at the time of mounting on an external mounting board, by forming a protruding part at the central part of an adjacent surface perpendicular to the element mounting surface of an insulating board, and forming plated electrode parts in through holes neighboring with each other so as to interpose said protruding part. CONSTITUTION:A protruding part 23 engaging with an external mounting board is formed in the central part of an adjacent surface 22 perpendicular to an element mounting surface 21 of an insulative resin board 12. Plated electrode parts 25, 26 which are formed continuously with solid plated patterns 13, 14 and connected with a wiring circuit of the external mounting board are formed in first through holes 24 adjacent to both sides interposing the protruding part 23. At the time of mounting on the external mounting board, the protruding part 23 is inserted into an insertion hole of the external mounting board, and positioning is performed. The plated electrode parts 25, 26 adjacent to the protruding part 23 are connected with a wiring part of the external mounting board. The optical axis of a semiconductor device becomes parallel with the mounting surface of the external mounting board, and exact positioning also is realized. |
