| 摘要 |
PURPOSE:To provide a method of placing a chip component simply and accurately to suit a small quantity and many kind production and a jig therefor. CONSTITUTION:The method for placing a chip component comprises first step of assembling a printed board 1 formed with solder paste 2 at a predetermined position with a printed board holder 3 to invert it, and a second step of so placing a mask 5 having a through hole 6 as to oppose a recess 8 on a magazine 9 formed with the recess 8 and passing chip components 10, 11 arranged on the mask via the holes 6 to drop to contain it in the recess 8 of the magazine. The method further comprises a third step of removing, after the components 10, 11 are contained in the magazine 9, the mask 5, and a fourth step of inverting the magazine 9 and the holder 3 to be superposed on the magazine 9 in which the mask 5 is removed in the third step and placing the components 10, 11 on the paste 2. |
