| 摘要 |
PURPOSE:To form a good quality soldering layer by setting a dip processing region on the surface of a pressing section and feeding molten solder to the dip processing region by way of a penetration hole formed on the pressing section which depresses the bottom of the molten solder locally from under the liquid level of the molten solder. CONSTITUTION:A pressing section 9 which depresses locally the liquid level of molten solder 8 in a liquid tank 5 is installed. The pressing section 9 which comprises iron or iron allay blocks with good wetting characteristics with molten solder, is provided with a pair of projected regions 12 and 13 right and left on the top where a plurality of penetration holes 14 and 15, which penetrate the blocks in the vertical direction, are installed respectively in the projected regions 12 and 13. A pair of inductors 18 and 19 right and left, which face each other by way of small clearances 16 and 17 serving as the dip processing regions consist of iron or iron alloy blocks on the surface of the projected regions 12 and 13. The small clearances 16 and 17 are set to such a range from 0.7mm to 1.8mm. This construction makes it possible to form a good quality solder layer by this application to the solder dip processing for leads of axial type electronic components. |
