| 摘要 |
<p>PURPOSE:To provide a wiring board for ultrathin semiconductor device use. CONSTITUTION:A backing sheet is laminated on a wiring board; a semiconductor chip is mounted. A through-hole device hole 3 is made in the wiring board 1; the backing sheet 4 which is larger than the device hole 3 is laminated. The semiconductor chip 5 is die-bonded by using an adhesive 6 for chip fixation use. The semiconductor chip 5 and a wiring pattern 2 are connected by means of bonding wires 7; after that, they are sealed with a sealing resin. When a base material in 0.2mm or lower is used for the backing sheet, a semiconductor device which is thinner than that in conventional cases can be formed. When the part of the semiconductor device is made thin in this manner, it is possible to make the thickness of other base materials thick in an IC card and the like, and the mechanical strength such as the bending strength or the like of the semiconductor device can be enhanced. In addition, when the backing sheet is formed of a conductive base material or a metal base material, it is provided with an electromagnetically shielding effect and a heat-dissipating effect against heat generated by the semiconductor chip.</p> |
