发明名称 METHOD FOR OBTAINING VIA-PATTERN IN CERAMIC SHEET AND DEVICE FABRICATED THEREWITH
摘要 <p>PURPOSE: To obtain a method for forming a via pattern in a ceramic sheet, a ceramic device created by this method, and an all-purpose tool suited for the method. CONSTITUTION: Vias 24 and 26 are arranged and further a non-conductive substance such as ceramic is selectively filled into at least one portion of the vias 24 and 26, thus creating a custom via pattern. The created via pattern is effective for manufacturing a grid transformer and a ceramic printed circuit board.</p>
申请公布号 JPH05102342(A) 申请公布日期 1993.04.23
申请号 JP19920082280 申请日期 1992.04.03
申请人 KUAAZU ELECTRON PACKAGE CO 发明人 BIRII EMU HAAGISU
分类号 H01L23/522;C04B35/622;H01L21/768;H01L23/12;H01L23/13;H05K3/46 主分类号 H01L23/522
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