发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To prevent the corrosion of a signal line which is passed through the region of a pad electrode which is not connected to the outside even when the pad electrode is corroded. CONSTITUTION:Pad electrodes 6, 7 for external-circuit connection use are formed of a metal interconnection layer in the uppermost layer; a signal interconnection, 3 is formed of a lower-layer metal interconnection layer. An interlayer insulating film 4 is laid between the signal interconnection 3 and the pad electrode 7 under the pad electrode 7 through which the signal interconnection 3 is passed. Thereby, it is possible to prevent the corrosion of the signal interconnection 3 even when the pad electrode 7 is corroded when moisture ingresses from the outside.</p>
申请公布号 JPH05102158(A) 申请公布日期 1993.04.23
申请号 JP19910260208 申请日期 1991.10.08
申请人 NEC KYUSHU LTD 发明人 MORITA TOSHIO
分类号 H01L23/52;H01L21/3205;H01L21/321;H01L21/60;H01L21/768;H01L23/522 主分类号 H01L23/52
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