首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD AND APPARATUS FOR ETCHING SEMICONDUCTOR SUBSTRATE
摘要
申请公布号
JPH05102124(A)
申请公布日期
1993.04.23
申请号
JP19910259034
申请日期
1991.10.07
申请人
NEC CORP
发明人
SHIBATA SHIGERU
分类号
H01L21/306
主分类号
H01L21/306
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Thermal interface device for heating elements
Armored axially displaceable sealing apparatus
Partially deamidated oilseed proteins and process for the preparation thereof
Process for the preparation of copolyarylene sulphides with reduced crystallization temperature
Silver halide color photographic material
Solenoid switch for use in engine starter motor
Constant current circuit
Feedback-controlled current output driver having reduced current surge
High temperature annealing to improve SIMOX characteristics
Process for denitrating aqueous, nitric acid and salt containing waste solutions
Rust converting and removing compositions
Calcium soaps possessing a high basicity reserve
Device for gripping and holding back articles, such as for example containers, on a conveyor, and conveyor equipped with this device
Quadrature probe for nuclear magnetic resonance
PREPARATION OF SURFACE CHARACTERISTIC CHART FOR ROAD
PHOTOGRAPHING DEVICE
SPUTTERING DEVICE
CLAMPING MECHANISM OF SHAFT
PRODUCTION OF OIL HOLE TAP
PRODUCTION OF MECHANISM OXIDE SUBSTANCE
