| 摘要 |
PURPOSE:To provide thick film paste capable of forming a thick film having high adhesive strength. CONSTITUTION:In copper paste 35 formed by kneading copper powder 37, glass 24, and organic vehicle 22, a microcapsule 30 wherein a substance 32 including oxygen is enclosed inside an outer skin 31 made of an organic substance is kneaded. In forming a copper thick film, the copper paste 35 is printed in a desired pattern on a ceramic substrate 2, and thereafter baking is applied in nitrogen atmosphere to form a copper thick film 3. Since the microcapsule 30 is kneaded in the copper paste 35, the microcapsule is destroyed at the time of baking to discharge oxygen into a paint film 21 so that desired oxygen is consumed to form the copper film 3 having high adhesive strength. Accordingly, thick film reliability as well as thick film yield is enhanced. |
