| 摘要 |
The package (case) comprises a heat-conducting base-plate 2 forming a heat sink and having a large face supporting the hybrid circuit 21s, a frame 3s framing the hybrid circuit and hermetically sealed on the large base-plate face, a lid hermetically closing the frame and at least one connection strip 5s hermetically penetrating the frame and supporting several conductors 51s for connecting the hybrid circuit to an external connector 6. In practice, on account of the high density of the electronic components included in the package (case), the pitch between strip conductors 51s is of the order of 0.5 or 0.25 mm. <IMAGE> |
