发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To provide a low cost multilayer printed wiring board which does not need screwed components and the like for fixing structural members and has a simple construction. CONSTITUTION:Theremoplastic film 1, 2, 3 and 4 are laminated and external heat and pressure are applied to the films to fix some of or all of structural members such as nuts 5 and reinforcing members which are held between the thermoplastic films 2 and 3. Because of the characteristics of thermoplastics, the board shows plastic deformation easily. Therefore, the board is deformed along the profile of the structural members to hold the structural members securely between the layers. With this constitution, it is not necessary to attach the structural members to the wiring board afterwards by using separate components such as fixing screws and nuts and the manufacture process and the construction of the interconnection board can substantially be simplified.
申请公布号 JPH05102663(A) 申请公布日期 1993.04.23
申请号 JP19910257685 申请日期 1991.10.04
申请人 TOSHIBA CORP 发明人 KAWASHIMA KOJI
分类号 H05K3/46 主分类号 H05K3/46
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