| 摘要 |
PURPOSE:To easily provide a measure for circuit modification in regard to a multilayer ceramic substrate by eliminating limitation on the number of external connecting terminals (the number of I/O pads) of a multilayer ceramic substrate to improve the yield thereof. CONSTITUTION:An external terminal 22 as an external connecting terminal for a connector, an internal terminal 23 and a terminal substrate wiring 24 for connecting both terminals are provided on a terminal substrate 2 and wiring connection varying terminals 21-2 and 21-2 for realizing disconnection and alteration of wiring of the terminal substrate wiring are also provided in the course of the terminal substrate wiring. A flexible substrate 3 is provided with an I/O receiving terminal 31 for electrically coupling with I/O pad 11, an internal receiving terminal 32 for electrical coupling with the internal terminal 23 and a flexible substrate wiring 33 for coupling both receiving terminals. |
