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发明名称
LEAD FORMING DIE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH05102367(A)
申请公布日期
1993.04.23
申请号
JP19910257893
申请日期
1991.10.04
申请人
SEIKO EPSON CORP
发明人
KOMIYAMA TADASHI
分类号
B21D37/04;H01L23/50
主分类号
B21D37/04
代理机构
代理人
主权项
地址
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