发明名称 X, Y TABLE DEVICE FOR BONDER
摘要 PURPOSE:To reduce the load of linear motors and move a wire bonder in the X, Y directions with high precision at a high speed by providing an X table device, a Y table device, and the wire bonder. CONSTITUTION:Linear motors 4, 14 are driven to slide a wire bonder 31 in the X, Y directions, and the bonding work such as wire bonding or bump formation is performed. Since a Y table device 11 is not installed on an X table device 1 but installed in parallel on its side, the load of the Y table device 11 is not applied to the X table device 1, and the wire bonder 31 can be smoothly moved in the X, Y directions at a high speed. A bonder such as the wire bonder 31 is smoothly slid in the X, Y directions at a high speed, and the bonding work such as wire bonding can be performed.
申请公布号 JPH05100062(A) 申请公布日期 1993.04.23
申请号 JP19910264478 申请日期 1991.10.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ARIKADO KAZUO
分类号 G12B5/00;H01L21/60 主分类号 G12B5/00
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