VERFAHREN ZUR SELEKTIVEN METALLISIERUNG, ADDITIVE METHODE ZUR HERSTELLUNG GEDRUCKTER TRAEGER VON SCHALTKREISEN UND DABEI VERWENDETE MATERIALMISCHUNG.

摘要

A process for selective metallization of a substrate in a predetermined desired pattern, and particularly for the manufacture of printed circuit boards, in which a substrate patterned in desired manner with resist material is treated with conditioning agent, adjuvant and deactivating agent preparatory to catalytic activation and electroless deposit of metal flash. By proceeding in this manner, adherent flash metal deposit is achieved on non-resist areas without encountering significant plating on resist areas. Following metal flash deposit, the resist can be easily and cleanly stripped and additional metal then built up on the flash metal.