| 摘要 |
The method makes it easy to seperate the semiconductor from a wafer holder (8) by blowing heated air at a pick-up point, and manages a vaccum force of a collet because a pin hole, perforated in a mylar, is reduced when the semi-conductor chip is ejected. The semiconductor ejection method comprises feeding the mylar, fixed to a wafer ring, to a chip supplying device (5); spraying air or nitrogen gas from a nozzle (18) through a heater (19) by opening a solenoid valve; pushing the chip upward by lifting the ejector (10) and absorbing the separated chip with the collet (15). The sprayed air or nitrogen is controlled within the range of 30-40 deg.C by use of a temperature sensor and a heat controller.
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