| 摘要 |
<p>Openings for contact holes, grooves, and through-holes are (38,39) formed in an insulating BPSG film (37) formed on a semiconductor substrate (36) including electrical circuit elements. Next, a conductive material (41) such as Al alloy is deposited over the entire substrate by sputtering technique, and then the insulating film is selectively removed from the substrate except for the regions at and near the openings.Thereafter, the Al alloy is caused to re -flow into the corresponding openings by means of laser light to form desired lead lines (30,31,33) in the openings (38,39). <IMAGE></p> |
