| 摘要 |
PURPOSE:To provide pads of certain structure which can be dispersedly disposed on all the surface of a semiconductor chip and a semiconductor integrated circuit where pads are dispersedly arranged in a wide range of area on the semiconductor chip without defects which cause difficulties to the test of an electric conduction state inside the pad or in regions proximate to the pads. CONSTITUTION:A semiconductor integrated circuit has such a structure that an input/output circuit semiconductor device pad provided with lower conductor layers 31 and 32 connected to two logic circuits and an upper conductor layer 34 which short-circuits the lower conductor layers 31 and 32, an input/output circuit which makes the upper conductor layer 34 serve as a bump or an input/ output circuit connected to input/output wirings, and these pads dispersedly arranged in a wide scope of area on a semiconductor chip are provided. |
