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发明名称
MANUFACTURE OF SEMICONDUCTOR SEALING RESIN MATERIAL
摘要
申请公布号
JPH0595057(A)
申请公布日期
1993.04.16
申请号
JP19910255441
申请日期
1991.10.02
申请人
SEIKO EPSON CORP
发明人
SHINDO AKINORI
分类号
H01L23/29;H01L23/31
主分类号
H01L23/29
代理机构
代理人
主权项
地址
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