| 摘要 |
PURPOSE:To reduce the size of a semiconductor device as required and enhance its heat dissipation properties. CONSTITUTION:Inner leads 9 are formed with a sheet thinner than outer leads 10. The leads are joined with their counterparts respectively. A semiconductor device 6 is mounted on the inner leads 9 by way of an insulation film 5 having a bonding agent 4 on both ends. |
