MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To prevent resin melted out of prepreg from entering a through hole made in advance in laminating a multilayer printed wiring board through thermal bonding with prepreg placed between printed wiring boards (PTB). CONSTITUTION:This manufacturing method includes a process of making hollow plated through holes 1a through printed wiring layers to be laminated and then applying heat-proof resin resist 2 to each of the surfaces to be bonded and to conceal the plated through holes 1a by the resultant film.