| 摘要 |
PURPOSE:To eliminate the effect of laser beam irradiation on a circuit, and to contrive improvement in productivity by a method wherein a semiconductor device is coated with the resin which is optically opaque, and a part of a resistor is cut off by projecting a laser beam thereon. CONSTITUTION:A semiconductor chip 2, on which an amplification circuit is integrated, is formed on a ceramic substrate 1, and a resistor 3 is formed in the vicinity of the chip 2. Then, the semiconductor chip 2 is connected to other circuit elements such as the resistor 3 and the like using a bonding wire 4. Further, a film of resin 5, which is optically opaque, is formed on the semiconductor chip 2 and the bonding wire 4. Subsequently, a laser beam is made to cast at the resistor 3, and the resistance value is adjusted by cutting a part of the thick film with which the resistor 3 is formed. Consequently, as the circuit of the semiconductor chip 2 is not subjected to the influence of the laser beam irradiation, the time required for trimming can be cut down, and productivity can be improved. |
