| 摘要 |
PURPOSE:To fix a light emitting diode so that the high ratio of successful bonding, a high reliability, an easy operation, and a shorter treating time are obtained, by applying and drying a micro-capsule adhesive on an inner wall of an opening and pressing the light emitting diode into the opening and sequentially breaking the micro-capsules and bonding the diode. CONSTITUTION:A micro-capsule adhesive 3 is applied and dried on an inner wall 21 of an opening 2 into which a light emitting diode 1 is to be inserted and fixed. Next, the light emitting diode 1 is pressed into the opening 2, and the micro-capsules of the adhesive 3 are broken. Then, the adhesive kept in the micro-capsules is uniformly applied between the outer circumference of the diode 1 and the inner wall 21 of the opening 2, and the diode 1 is bonded. For example, a viscous liquid micro-capsule adhesive which is dissolved in a solvent is applied on the surface of a cylindrical balloon 5. The balloon 5 is expanded inside the opening 2 and the micro-capsule adhesive is moved to the inner wall 21 of the opening 2. |
