| 摘要 |
PURPOSE:To provide an electronic component mounting substrate which is compact in size to a satisfactory extent and easy to manufacture, highly increased in density (made finer) and excellent in heat dissipation properties. CONSTITUTION:Each lead 21 is arranged in such a fashion that one side may be exposed in a loading recess 12 while the other side may be provided with a recess 22 positioned on the opposite side of an insulation base material 10. Each of these leads 21 is integrated with resin 24 sealed in each recess 22 while the outside portion of each lead 21 is cut together with the insulation base material under control, thereby exposing at least an outer end side of each lead 21. |
