| 摘要 |
PURPOSE:To obtain a positive type photosensitive resin composition capable of producing uniform film equally coated in thickness, excellent in flatening property and being usable for electronic parts manufacturing field. CONSTITUTION:In a positive type resist composition formed by dissolving an alkali solution soluble resin and compound containing quinone diazide group into an org. solvent, the org. solvent has properties of 160-180 deg.C b.p. (760mmHg), 1-2cP viscosity (20 deg.C) and <=70cal/g latent heat of evaporation to produce the positive type photosensitive resin composition. |
