| 摘要 |
PURPOSE:To improve the electromagnetic shield efficiency of an electronic circuit board and lighten the discharge to outside of noise occurring inside an IC chip by covering the IC chip with a substance high in conductivity and magnetic permeability, and shielding the IC itself electrostatically and electromagnetically. CONSTITUTION:In a mold type package, a resin sealing material is made three layers. That is, the resin charged in the first layer 3 is made a protective material for an IC chip 4 and a bonding wire 5 and an insulating material between i/o terminals 6. Moreover, the second layer 2 is charged with resin including substance high in conductivity and magnetic permeability and it is made a shield material for electrostatic and electromagnetic shielding. Furthermore, the third layer 1 electrically insulates i/o terminals 6 from each other, and the charge material of the second layer 2 and the board where IC is mounted from each other. Hereby, the effect of the anti-noise measure in an electronic circuit board or an electronic apparatus can be improved, and the high-density mounting of the electronic circuit board or the thinning and the contraction of the electronic equipment can be materialized. |
