发明名称 STRAIN ISOLATED INTEGRATED OPTIC CHIP PACKAGE
摘要 2120700 9307519 PCTABS00021 A package for an IOC fabricated from an anisotropic material, such as X-cut lithium niobate or lithium tantalate, having identical thermal expansion coefficients in the X and Y directions and a different thermal expansion in the Z direction, or for an IOC fabricated from an isotropic material, such as gallium arsenide or silicon, includes an IOC enclosure having a planar mounting surface which has identical thermal expansion coefficients in the X and Y directions. The coefficients of the planar mounting surface are relatively similar to the thermal expansion coefficients of a planar surface of the IOC. A planar surface of the IOC is attached to the planar mounting surface of the package.
申请公布号 CA2120700(A1) 申请公布日期 1993.04.15
申请号 CA19922120700 申请日期 1992.10.07
申请人 UNITED TECHNOLOGIES CORP 发明人 HOCKADAY BRUCE D
分类号 G02B6/122;G02B6/12;G02B6/30;G02B7/00;(IPC1-7):G02B6/12 主分类号 G02B6/122
代理机构 代理人
主权项
地址