| 摘要 |
<p>A curved lead (14) provides a mechanical and electrical connection between a board contact (21) on a circuit board (20) and a chip contact (16) associated with a circuit chip (18). The chip (18) c an be mounted to the circuit board (20), to a chip carrier (12) or to a multiple-chip module (90). The curved lead (14) is substantiall y entirely plated with solder and is formed of a single piece of conductive material (56). The curved lead (14) has a first surface (58) for connection to the chip contact (16) and a second surface (60), generally parallel to the first surface (58), for connection t o the board contact (21). The first and second surfaces (58, 60) are connected by at least one curved portion and are arranged to mount t he circuit chip (18) to the circuit board (20) with the solder in a compliant, generally parallel arrangement substantially free of stress.</p> |
